Back panel I/O ports
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Microphone in:The socket where a microphone is connected to the device.
Headphone outputs:Number of sockets /ports where headphones are connected.
1
DisplayPorts quantity:Number of DisplayPorts. A DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio, USB, and other forms of data.
1
HDMI ports quantity:The number of sockets (ports) for HDMI connections. HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed/uncompressed digital audio data from a HDMI-compliant device ("the source device") to a compatible computer monitor, video projector, digital television, or digital audio device. HDMI is a digital replacement for existing analog video standards.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4
BIOS
BIOS memory size:
128 Mbit
Expansion slots
Number of M.2 (M) slots:
3
PCI Express x16 (Gen 4.x) slots:
1
PCI Express x1 (Gen 3.x) slots:
1
Features
Windows operating systems supported:Windows vesions wich can be used with the device.
Windows 10 x64, Windows 11 x64
Audio output channels:An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels.
7.1 channels
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
Intel B760
Motherboard chipset family:The category of motherboard chipset e.g. Intel, AMD.
Intel
Motherboard form factor:Design of the motherboard (ATX, BTX etc).
ATX
Component for:What this product is used as a part of (component for).
PC
Graphics
Parallel processing technology support:Parallel processing technology is the simultaneous use of more than one CPU or processor core to execute a program or multiple computational threads. Ideally, parallel processing makes programs run faster because there are more engines (CPUs or Cores) running it. In practice, it is often difficult to divide a program in such a way that separate CPUs or cores can execute different portions without interfering with each other. Most computers have just one CPU, but some models have several, and multi-core processor chips are becoming the norm. There are even computers with thousands of CPUs.
Not supported
Internal I/O
Number of COM connectors:
1
EPS power connector (8-pin):
Number of chassis fan connectors:
4
ATX Power connector (24-pin):
Front panel audio connector:
Number of SATA III connectors:Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.
4
USB 3.2 Gen 1 (3.1 Gen 1) connectors:
1
USB 2.0 connectors:The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black.
2
Memory
Maximum internal memory:The maximum internal memory which is available in the product.
192 GB
Memory channels:
Dual-channel
Memory slots type:A memory slot, also known as a memory socket or RAM slot, is what allows computer memory (RAM) to be inserted into the computer. Depending on the motherboard, there will usually be 2 to 4 memory slots (sometimes more on high-end motherboards). The most common types of RAM are SDRAM and DDR for desktop computers and SODIMM for laptop computers, each having various types and speeds.
DIMM
Supported memory types:Types of memory which can be used with the product.
DDR5-SDRAM
Network
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Ethernet interface type:
2.5 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Networking
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Ethernet interface type:
2.5 Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Other features
Number of M.2 (E) slots:
1
Packaging content
Packaging data
Package weight:Weight of the packaged product.
2.43 kg
Package height:The distance from the top to the bottom of the packaging.
68 mm
Package depth:The distance from the front to the back of the packaging.
273 mm
Package width:The distance from one side of the packaging to the other.
338 mm
Processor
Supported processor sockets:The sockets (plugs) for processors that are supported (can be used) by the device.
LGA 1700
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
Intel® Celeron®, Intel® Pentium® Gold, Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7, Intel® Core™ i9
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 1700
Processor manufacturer:The manufacturer that produced the processor.
Intel
Rear panel I/O ports
S/PDIF out port:S/PDIF (Sony/Philips Digital Interconnect Format) is a digital audio interconnect used in consumer audio equipment over relatively short distances. The signal is transmitted over either a coaxial cable with RCA connectors or a fibre optic cable with TOSLINK connectors.
Microphone in:The socket where a microphone is connected to the device.
Headphone outputs:Number of sockets /ports where headphones are connected.
1
DisplayPorts quantity:Number of DisplayPorts. A DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio, USB, and other forms of data.
1
HDMI ports quantity:The number of sockets (ports) for HDMI connections. HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed/uncompressed digital audio data from a HDMI-compliant device ("the source device") to a compatible computer monitor, video projector, digital television, or digital audio device. HDMI is a digital replacement for existing analog video standards.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
1
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
4
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
4
Storage controllers
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 5, 10
RAID support:The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
Supported storage drive interfaces:
M.2, SATA III
Supported storage drive types:
HDD & SSD
Weight & dimensions
Height:The measurement of the product from head to foot or from base to top.
50 mm
Depth:The distance from the front to the back of something.
244 mm
Width:The measurement or extent of something from side to side.
305 mm
